HBM Samsung In stock

HBM3 24GB

Next-generation HBM for the most demanding AI and HPC workloads.

Part number: DJ-HBM3-24G

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HBM3 24GB illustration
Samsung DJ-HBM3-24G
Capacity24GB
InterfaceHBM3
Speed6.4 Gbps
Voltage1.1V
Temperature0°C to 95°C
Form factorStacked die
Overview

Built for dependable integration

Next-generation HBM for the most demanding AI and HPC workloads.

  • 6.4 Gbps per pin
  • High stack density
  • Advanced thermal design
AI accelerator HPC Generative AI

Technical specifications

Part number DJ-HBM3-24G
Brand Samsung
Category HBM
Capacity 24GB
Interface HBM3
Speed 6.4 Gbps
Voltage 1.1V
Operating temperature 0°C to 95°C
Form factor Stacked die
Availability In stock
Stack 12-high
Bus width 1024-bit
Selection guide

HBM series comparison

HBM stacks deliver extremely high bandwidth in a compact footprint for data centre accelerators and high-performance computing.

HBM selection guide
Part number Capacity Interface Speed Temperature Form factor
DJ-HBM2E-16G 16GB HBM2E 3.2 Gbps 0°C to 95°C Stacked die View
DJ-HBM3-24G 24GB HBM3 6.4 Gbps 0°C to 95°C Stacked die View
DJ-HBM2-8G 8GB HBM2 2.4 Gbps 0°C to 95°C Stacked die View
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