HBM SK Hynix In stock

HBM2E 16GB

High bandwidth memory for AI accelerators and high-performance computing.

Part number: DJ-HBM2E-16G

HBM2E 16GB illustration
SK Hynix DJ-HBM2E-16G
Capacity16GB
InterfaceHBM2E
Speed3.2 Gbps
Voltage1.2V
Temperature0°C to 95°C
Form factorStacked die
Overview

Built for dependable integration

High bandwidth memory for AI accelerators and high-performance computing.

  • 3.2 Gbps per pin
  • Stacked die architecture
  • High bandwidth density
AI accelerator HPC Data centre GPU

Technical specifications

Product specifications
Part number DJ-HBM2E-16G
Brand SK Hynix
Category HBM
Capacity 16GB
Interface HBM2E
Speed 3.2 Gbps
Voltage 1.2V
Operating temperature 0°C to 95°C
Form factor Stacked die
Availability In stock
Stack 8-high
Bus width 1024-bit
Selection guide

HBM series comparison

HBM stacks deliver extremely high bandwidth in a compact footprint for data centre accelerators and high-performance computing.

HBM selection guide
Part number Capacity Interface Speed Temperature Form factor Details
DJ-HBM2E-16G 16GB HBM2E 3.2 Gbps 0°C to 95°C Stacked die View
DJ-HBM3-24G 24GB HBM3 6.4 Gbps 0°C to 95°C Stacked die View
DJ-HBM2-8G 8GB HBM2 2.4 Gbps 0°C to 95°C Stacked die View
Related parts

More HBM products

HBM Samsung

HBM3 24GB

DJ-HBM3-24G

Capacity
24GB
Interface
HBM3
Temperature
0°C to 95°C
HBM Micron

HBM2 8GB

DJ-HBM2-8G

Capacity
8GB
Interface
HBM2
Temperature
0°C to 95°C
Next step

Request pricing and availability for DJ-HBM2E-16G.

Send us your target quantity, preferred brand and delivery schedule.